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DE-CAPSULATION TEST
ENCAPSULATION WILL EXPOSE THE DIE IN ANY PLASTIC IC PACKAGE BY ETCHING AWAY THE DIE’S PLASTIC COVERING. THIS PROCESS WILL ALLOW US TO SEE IF THERE IS ACTUALLY A DIE INSIDE THE PACKAGE. DECAP WILL ALSO SHOW DIE TOPOGRAPHY, MANUFACTURER MARKINGS, COPYRIGHT DATE, PART NUMBER, CONSISTENCY IN DIE SIZE FROM DIFFERENT DATE CODES, AND BOND WIRES.

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Email:andeic@andesource.com
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